Pressure synergy
Temperature matches positive and negative pressure by solid crystal process.
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Positive/negative-pressure die-bonding oven
VNPCO-800 cleanroompositive/negative-pressure die-bonding oven
VNPCO-800 cleanroompositive/negative-pressure die-bonding oven, model VNPCO-800; configuration can be confirmed for the process, dimensions and line requirements.
Highlights
Cover Orientation
Service semiconductor solid crystal related processes.
Programmable
Enables the re-emergence of a solid curve.
Customized Plugins
Click on the device to dock with the cure.
Overview
Positive and negative pressure cementing crystal furnaces for processes such as solid crystals that require pressure-to-temperature synergy.
Key data
ProcessPositive/negative-pressure die bonding
ApplicationsSemiconductor packaging
ControlProgrammable pressure and temperature
NotesPressure range and fixtures configured per project
Process / industry use
- Semiconductor packaging
- Die-bonding void removal
- Precision manufacturing
Need a process-fit design?
Send temperature, atmosphere, takt and workpiece size to engineering and sales.
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