Reflow ovens are core to soldering electronic parts; vacuum reflow is an advanced type with clear differences in structure and process. Analysis below covers structure and process traits:
vacuum 1. vacuum vacuum vacuum vacuum 10⁻²~10⁻³ Pa vacuum IR hot-air hot-air + vacuum vacuum vacuum ±5℃ PCB PCB vacuum vacuum 1000ppm vacuum + vacuum vacuum vacuum vacuum - PCB vacuum vacuum 5~10℃ / s 2. vacuum vacuum vacuum vacuum ≥200 L / min vacuum vacuum "vacuum - " 1~2 atm
vacuum 1. and vacuum vacuum vacuum ≤10⁻³ Pa vacuum + → → → 3~5 vacuum → → → → vacuum vacuum 5~10 15~30 vacuum vacuum IMC 2. and 3~5℃ / s 210~230℃ Sn63Pb37 hot-air vacuum 1~2℃ / s vacuum 220~240℃ vacuum vacuum vacuum vacuum 100 Pa 10⁻³ Pa vacuum ≤10⁻³ Pa 100~500 Pa BGA vacuum 5% 0.5% 3. and vacuum vacuum 0.1% IGBT 5% 10~20%
III. Summary - core logic of differences. Ordinary reflow aims at high-volume, cost-first conventional soldering. Vacuum reflow solves high-reliability joints by removing oxidation and voids in vacuum, trading some efficiency for quality. Strengths: ordinary = low cost, high throughput, easy service; vacuum = very reliable joints, low voiding, no oxidation risk for high-end use.
