Inline
Chamber, controls and loading configured to the shop-floor process.
Home / Products / Semiconductor equipment / CS-VR8N inline vacuum reflow oven
inline vacuum reflow oven
CS-VR8N inline vacuum reflow oven
CS-VR8N inline vacuum reflow oven, model CS-VR8N; configuration can be confirmed for the process, dimensions and line requirements.
Highlights
vacuum reflow
Chamber, controls and loading configured to the shop-floor process.
Multi-zone
Chamber, controls and loading configured to the shop-floor process.
Overview
The CS-VR inline vacuum reflow oven combines strong hot-air convection, a vacuum module and multiple temperature zones to reduce solder-joint voiding and support continuous production.
Key data
Transfer speed0.2 to 3.0 m/min
Process temperatureMax. 300 / 350 / 320℃, 400℃ optional
Vacuum levelStandard ≤5mbar; optional ≤1mbar
Effective vacuum chamber sizeApprox. L450 × W520mm
Track width60 to 525mm
Cooling zones4 water-cooled zones
Process / industry use
- PCB
- DCB substrates
- Semiconductor packaging
Need a process-fit design?
Send temperature, atmosphere, takt and workpiece size to engineering and sales.
Send inquiry