vacuum reflow
Chamber, controls and loading configured to the shop-floor process.
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offline vacuum reflow oven
ZKSO-L offline vacuum reflow oven
ZKSO-L offline vacuum reflow oven, model ZKSO-L; configuration can be confirmed for the process, dimensions and line requirements.
Highlights
Low voiding
Chamber, controls and loading configured to the shop-floor process.
Offline
Chamber, controls and loading configured to the shop-floor process.
Overview
ZKSO offline vacuum reflow ovens suit heat-resistance verification of precision components, high-temperature ageing of materials and vacuum reflow soldering.
Key data
Temperature rangeAmbient +15℃ to 300℃ / 350℃
Max. custom temperature450℃
Heating rateMax. 100℃/min
Standard vacuum100Pa
Custom vacuumAs low as 1.01×10⁻³Pa to 1.01×10⁻⁹Pa
Standard volume27L / 125L / 560L
Process / industry use
- Semiconductor packaging
- Power devices
- Precision soldering
Need a process-fit design?
Send temperature, atmosphere, takt and workpiece size to engineering and sales.
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