PCB baking is a key electronics step to remove moisture and VOCs for quality and reliability. Copper plating and process chemicals/water leave residues that can cause oxidation, corrosion or shorts. After manufacture, baking drives off surface and internal moisture and chemicals to raise stability and reliability.
Points to note when baking PCB boards:
1. Temperature control: raise bake temperature gradually; typically about 100℃ for 10-15 minutes for PCBs.
2. Bake face-down so heat transfers evenly across the PCB and moisture/damage is avoided.
3. Dryness check: wipe the PCB with tissue or dry cloth after baking; no water marks means fully dry.
4. Avoid PCB damage: prevent impacts and abrasion during baking; place boards on dedicated baking racks.
5. Environment: avoid moisture, mould or other contaminants; bake in a relatively dry, ventilated place.
PCB baking is an indispensable electronics step: control time, temperature and environment, and protect the board for long-term stable, reliable operation.
